Droplet ejection apparatus, a pattern formation apparatus, a wiring formation apparatus, a pattern formation medium, a droplet ejection method, a patterning method and a wiring formation method

摘要

After a dispersion medium with a dispersed dispersoid or a solvent medium with a dissolved solute is ejected onto a substrate, the dispersoid or the solute is aggregated on both sides of the dispersion medium or the solvent medium by convecting the dispersoid or the solute within the dispersion medium or the solvent medium.