发明名称 POWER-GROUND PLANE PARTITIONING AND VIA CONNECTION TO UTILIZE CHANNEL/TRENCHES FOR POWER DELIVERY
摘要 An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
申请公布号 WO03067943(A2) 申请公布日期 2003.08.14
申请号 WO2003US02360 申请日期 2003.01.23
申请人 INTEL CORPORATION 发明人 SATO, DARYL;BRIST, GARY;LONG, GARY
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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