发明名称 |
ABRASIVE AND METHOD FOR POLISHING SEMICONDUCTOR SUBSTRATE |
摘要 |
A semiconductor wafer or a film formed thereon is polished by using a polishing agent comprising abrasive containing silica particles as the main component, water as a solvent, and a water-soluble cellulose, an alkali metal impurity content of the polishing agent being 5C ppm or less where the polishing agent contains C% by weight of the water-soluble cellulose, so as to flatten the semiconductor wafer without doing damage to the wafer or the film formed thereon and without bringing about a dishing problem in the polished surface. |
申请公布号 |
EP0933166(B1) |
申请公布日期 |
2003.08.13 |
申请号 |
EP19980919496 |
申请日期 |
1998.05.06 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;TOKUYAMA CORPORATION |
发明人 |
MIYASHITA, NAOTO;MINAMI, YOSHIHIRO;DOI, KENJI;TAKAYASU, JUN;KOHNO, HIROYUKI;KATO, HIROSHI;HAYASHI, KAZUHIKO |
分类号 |
B24B37/00;B24C1/00;B24D3/20;B24D3/34;C08B11/20;C09G1/02;H01L21/321 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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