摘要 |
Canned pump (1) comprising a housing, a rotor (7) contained in the housing, a circuit substrate (61) supported on the housing, semi-conductor means (63) for power control attached to the circuit substrate (61), an end cover (48) attached to the housing to cover the circuit substrate (61), and a heat sink (62) having heat radiating means (62a) for cooling the semi-conductor means for power control. The semi-conductor means (63) for power control is mounted on a surface of the circuit substrate (61) facing to the end cover (48). The heat sink (62) is attached to the circuit substrate (61) to cover the semi-conductor means (63) for power control. <IMAGE> |
申请人 |
CALSONIC KANSEI CORPORATION |
发明人 |
SUNAGA, HIDEKI;NAKAMURA, SHIRO;YAMADA, KAZUNORI;MACHIDA, KATSUHIRO;ASAYAMA, YOSHINORI;KAMIOKA, HIROYUKI;KURAMOCHI, SATOSHI |