发明名称 |
Substrate treatment apparatus and substrate treatment method |
摘要 |
A substrate treatment apparatus comprising: a pretreatment means (68) for bombarding liquid droplets against a surface of a substrate (W), the liquid droplets being generated by mixing a pretreatment liquid comprising ammonia and an oxidizing agent with a gas; and an etching liquid supplying means (7) for supplying an etching liquid onto the substrate (W) surface. The oxidizing agent is, for example, hydrogen peroxide. The pretreatment means (68) may comprise a bi-fluid nozzle (68) which generates the droplets of the pretreatment liquid and ejects the liquid droplets onto the substrate (W) surface. |
申请公布号 |
EP1335412(A2) |
申请公布日期 |
2003.08.13 |
申请号 |
EP20030001859 |
申请日期 |
2003.01.29 |
申请人 |
DAINIPPON SCREEN MFG. CO., LTD. |
发明人 |
IZUMI, AKIRA;KIYOSE, HIROMI;NOGUCHI, SACHIKO |
分类号 |
H01L21/304;B05B7/06;H01L21/00;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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