Resin-moulded semiconductor device and method for manufacturing the same

摘要

A resin-molded semiconductor device comprising a die pad, a central portion of the die pad being elevated above a peripheral portion thereof surrounding the central portion; a semiconductor chip mounted on the central portion of the die pad; a plurality of support leads for supporting the die pad; a plurality of signal leads extending toward the die pad; a plurality of metal fine wires for electrically connecting the semiconductor chip to the signal leads; and a resin encapsulant for encapsulating the semiconductor chip, the die pad, the support leads, the metal fine wires and the signal leads such that the lower and outer side faces of each said signal lead are exposed as an external terminal and that a lower part of the signal lead protrudes downward, wherein part of the resin encapsulant is interposed between the upper surface of the die pad at the peripheral portion and the backside of the semiconductor chip, and wherein a groove is provided in the upper surface of the die pad at the peripheral portion so as to surround the central portion.