发明名称 |
ACTIVE HEAT SINK STRUCTURE WITH FLOW AUGMENTING RINGS AND METHOD FOR REMOVING HEAT |
摘要 |
<p>An active heat sink is described for use in the transfer of heat from a heat generating device such as a semiconductor chip and the like with a heat sink having an embedded fan surrounded by a plurality of heat conducting flow augmenting rings separated by apertures through which a radially inward flow arises and with the rings being sufficiently axially separated to enable fan propeller tip vortices to penetrate the axial spacings so as to cause a substantial cooling of annular ring regions so as to raise the overall heat transfer coefficient of the active heat sink in a significant manner. Several embodiments are described.</p> |
申请公布号 |
EP0882207(B1) |
申请公布日期 |
2003.08.13 |
申请号 |
EP19970907624 |
申请日期 |
1997.02.20 |
申请人 |
LEMONT AIRCRAFT CORPORATION |
发明人 |
LEMONT, ANDREW, I.;RADZIUNAS, JEFFREY |
分类号 |
H01L23/38;H01L23/427;H01L23/467;(IPC1-7):F28F7/00;F28F13/12 |
主分类号 |
H01L23/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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