| 摘要 |
PROBLEM TO BE SOLVED: To obtain an inexpensive and highly moisture-permeable packaging method. SOLUTION: An adhesive layer is provided in advance on a part or a whole of a single-layered polyamide resin film with a thickness of 10 to 50μm, and the polyamide resin film is sealed via the adhesive layer to be made into a bag form, thereby providing the packaging method. The adhesive layer is preferably a polyester-based resin with a thickness of 0.01 to 15μm. In addition, the polyamide resin film preferably has one or more holes per bag, and the film preferably has one or more fine holes with an open hole area of 0.05 mm<SP>2</SP>or less of a single opening. COPYRIGHT: (C)2003,JPO
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