发明名称 |
Variably configured sprayjet cooling system |
摘要 |
A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are set in an array to spray a target area, and a controller controls which sprayers are activated based on information delineating the locations of the components to be cooled. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
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申请公布号 |
US6604370(B2) |
申请公布日期 |
2003.08.12 |
申请号 |
US20010943942 |
申请日期 |
2001.08.31 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
BASH CULLEN E.;PATEL CHANDRAKANT D. |
分类号 |
F25D19/00;G06F1/20;H01L23/473;(IPC1-7):F28D3/00;F25D23/12;H05K7/20 |
主分类号 |
F25D19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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