发明名称 Process for producing an integrated semiconductor memory configuration
摘要 A process for producing an integrated semiconductor memory configuration, in particular one suited to the use of ferroelectric materials as storage dielectrics, in which a conductive connection between one electrode of a storage capacitor and a selection transistor is not produced until after the storage dielectric has been deposited; and a semiconductor memory configuration produced using the production process.
申请公布号 US6605505(B2) 申请公布日期 2003.08.12
申请号 US20010883011 申请日期 2001.06.15
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HINTERMAIER FRANK;MAZURE-ESPEJO CARLOS
分类号 H01L21/02;H01L21/768;H01L21/8242;H01L21/8247;H01L27/10;H01L27/108;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824 主分类号 H01L21/02
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