| 摘要 |
PROBLEM TO BE SOLVED: To supply the optimum and necessary quantity of cutting fluid and simplify the adjustment of a cutting fluid supply position and a flow rate in cutting an electronic part such as a semiconductor wafer, an optical part or the like with a rotating blade. SOLUTION: A device, called a dicer or a slicer shown in a figure 1 as an example, exists. When cutting fluid is supplied to a blade 1 rotating at a high speed as shown in a figure 2, a plurality of holes are bored on the back surface (or the front surface) of a flange 2 to form a cutting fluid flow inlet to the flange 2, cutting fluid is sprayed from a separated place (a nozzle 4) guided to a flow passage 5 of the flange 2, guided cutting fluid is radially jetted out from a plurality of openings 6 on an outer peripheral part by the centrifugal force of the rotating flange 2 and is guided to the outer peripheral cutting edge of the blade the supporting of cutting fluid supply and washing of the blade are performed by the combination of the nozzles 13, 14. COPYRIGHT: (C)2003,JPO |
