发明名称 Method for correcting process temperature profile in a multi-zone thermal processor
摘要 A method for adjusting process temperature measurements used to monitor zone conditions in a reflow oven selects values for exclusion from correlation with the predicted part temperature profile. During the thermal process, a plurality of process temperatures over intervals may be measured along the reflow oven. Over a time period for the thermal process, a measured process temperature of this plurality may be evaluated for the maximum and minimum extremities, from which a difference for that interval may be calculated. This difference may be compared to a qualifier for the plurality, and be excluded from part temperature prediction if the difference for the interval exceeds the qualifier.In an alternative embodiment, the maximum and/or minimum extremities from the plurality of process temperature measurements may be incorporated to produce a process temperature profile for correlation with the part temperature profile. The incorporation of measurement extremities may substitute for time-integrated measurement values otherwise used for attaining a target part temperature response.
申请公布号 US6606537(B1) 申请公布日期 2003.08.12
申请号 US20010839325 申请日期 2001.04.19
申请人 KIC THERMAL PROFILING 发明人 KAZMIEROWICZ PHILIP C.;MOREAU MILES F.
分类号 G05D23/19;(IPC1-7):G05D23/00;G06F15/46 主分类号 G05D23/19
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