发明名称 Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
摘要 A multilayer capacitor is constructed to minimize equivalent series inductance (ESL) and to achieve large capacitance. The capacitor includes first and second main go surface terminal electrodes provided on a first main surface of the main body of the multilayer capacitor. First and second side surface terminal electrodes are disposed on four side surfaces of the main body. The main body is divided into a low ESL section of the first main-surface side and a high capacitance section of the second main-surface side. In the low ESL section, in addition to first and second low ESL internal electrodes, a first conductive via-hole electrically connecting the first low ESL internal electrode to the first main surface terminal electrode and a second conductive via-hole electrically connecting the second low ESL internal electrode to the second main surface terminal electrode are provided. In the high capacitance section, in addition to first and second high capacitance internal electrodes, a first leading electrode electrically connecting the first high capacitance internal electrode to the first side surface terminal electrode and a second leading electrode electrically connecting the second high capacitance internal electrode to the second side surface terminal electrode are provided.
申请公布号 US6606237(B1) 申请公布日期 2003.08.12
申请号 US20020180629 申请日期 2002.06.27
申请人 MURATA MANUFACTURING CO., LTD.;INTEL CORPORATION 发明人 NAITO YASUYUKI;TANIGUCHI MASAAKI;KURODA YOICHI;HORI HARUO;FIGUEROA DAVID G.;RODRIGUEZ JORGE P.;WATTS NICHOLAS R.;HOLMBERG NICHOLAS L.;HIOKI TAKASHI
分类号 H01G4/30;H01G4/232;H01G4/40;H01L23/12;H05K1/02;H05K1/18;(IPC1-7):H01G4/228;H01G4/005 主分类号 H01G4/30
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