| 摘要 |
A wafer level packaging process for making flip-chips and integrated circuits formed are proposed. The process comprises in turn, providing a wafer, forming a protective material, bumping the wafer, removing the protective material, probing the wafer, laser repairing, and dicing the wafer. The laser repairing step is after bumping step. The protective material such as photoresist or metal layer is filled into the depression portions above the fuses for temporary protection of the fuses during bumping.
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