| 摘要 |
A semiconductor package including a sealing part which is bonded to a lead frame. The lead frame is formed to include portions of reduced thickness for purposes of providing maximum crack prevention during a singulation process involved in the manufacture of the semiconductor package. Additionally, the lead frame and the sealing part are sized and configured relative to each other so as to maximize the contact area therebetween, thus having the effect of improving the bonding strength between the lead frame and the sealing part. This increased contact area between the sealing part and the lead frame also maximizes the lengths of those passages susceptible to moisture permeation, thus minimizing such moisture permeation potential.
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