| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device capable of uniformly dressing a polishing surface, and improving the in-plane equality of a subject to be polished after polishing. <P>SOLUTION: This polishing device comprises a polishing table 11 having the polishing surface 10, and a dresser 33 to dress the polishing surface 10 so that a semiconductor wafer W is pressed to the polishing surface 10 to be polished. The dresser 33 is provided with a flange part 35 relatively movable up and down to the polishing surface 10, a plurality of dressing members 34 to dress the polishing surface 10, and a holding mechanism 36 to hold the dressing member 34 to be relatively movable up and down to the flange part 35. <P>COPYRIGHT: (C)2003,JPO |
