Apparatus for curing resist

摘要

A resist curing device including a workpiece stage with a plate adapted to support a silicon wafer laid thereupon, a workpiece retention device that vacuum adsorbs the silicon wafer laid upon the plate, a light source unit that provides ultraviolet irradiation to cure resist applied to the silicon wafer, and a workpiece temperature control device that heats and/or cools the silicon wafer supported on the plate, where the plate has an expansion coefficient substantially similar to that of the silicon wafer.