发明名称 Transfer molded packages with embedded thermal insulation
摘要 An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.
申请公布号 US6606425(B1) 申请公布日期 2003.08.12
申请号 US20020100277 申请日期 2002.03.18
申请人 JDS UNIPHASE CORPORATION 发明人 CRAFTS DOUGLAS E.;ISHIDA KENZO;CHAPMAN DAVID J.;COOK DUANE;FARRELL JAMES F.;RAMALINGAM SURESH;SWAIN STEVEN M.
分类号 G02B6/34;G02B6/42;(IPC1-7):G02B6/12 主分类号 G02B6/34
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