发明名称 |
MICROMACHINE STRUCTURE HAVING ADHESION PREVENTIVE FILM, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a micromachine structure having an adhesion preventive film, and a method for manufacturing the same. SOLUTION: This micromachine structure comprises a substrate 100, at least one movable structure 108 which gets in contact with a surface facing the substrate 100, and an electrode 104 to conduct an electric connection with the movable structure 108. For a passivation layer 110 formed by a plasma chemical vapor deposition method on the whole surface of the substrate 100, the adhesion preventive film 110 is formed in an area except for the upper surface of the movable structure 108 and the upper surface of a part of the electrode 104. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003225896(A) |
申请公布日期 |
2003.08.12 |
申请号 |
JP20020339262 |
申请日期 |
2002.11.22 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHO SOKO;SHIN KEISAI;KIM WOON-BAE |
分类号 |
B81B3/00;B81C1/00;G02B26/08;(IPC1-7):B81B3/00 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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地址 |
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