发明名称 MICROMACHINE STRUCTURE HAVING ADHESION PREVENTIVE FILM, AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a micromachine structure having an adhesion preventive film, and a method for manufacturing the same. SOLUTION: This micromachine structure comprises a substrate 100, at least one movable structure 108 which gets in contact with a surface facing the substrate 100, and an electrode 104 to conduct an electric connection with the movable structure 108. For a passivation layer 110 formed by a plasma chemical vapor deposition method on the whole surface of the substrate 100, the adhesion preventive film 110 is formed in an area except for the upper surface of the movable structure 108 and the upper surface of a part of the electrode 104. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003225896(A) 申请公布日期 2003.08.12
申请号 JP20020339262 申请日期 2002.11.22
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHO SOKO;SHIN KEISAI;KIM WOON-BAE
分类号 B81B3/00;B81C1/00;G02B26/08;(IPC1-7):B81B3/00 主分类号 B81B3/00
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