发明名称 Bonding method and bonding structure of thermoplastic resin material
摘要 A PEI film to be bonded is disposed on a glass epoxy substrate through an alkane film, and a position to be adhered is heated to a temperature not less than the glass transition point Tg of the PEI film, thereby forming an adhesion-improving layer in which the alkane is dispersed into the PEI film, in the PEI film at the interface with the glass epoxy substrate. That is, the PEI film is bonded to the glass epoxy substrate through the adhesion-improving layer. Therefore, an adhesive strength is improved because the adhesion-improving layer has an elastic modulus lower than that of the PEI film.
申请公布号 US6605357(B1) 申请公布日期 2003.08.12
申请号 US20000621134 申请日期 2000.07.20
申请人 DENSO CORPORATION 发明人 MIYAKE TOSHIHIRO;KOJIMA KATSUAKI;IWAMA HIROYASU
分类号 C08J5/12;B29C65/42;B29K67/00;B32B27/08;C09J5/06;C09J5/10;H05K3/00;H05K3/36;(IPC1-7):B32B31/06;B32B7/04 主分类号 C08J5/12
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