| 摘要 |
<p>A method for finding optimum bond parameters for a bond force F<SUB>B </SUB>and an ultrasonic variable P and, optionally, at least one further bond parameter of a wire bonder uses a sensor sensitive to a shear force exerted by the capillary on a connection point. A predetermined number of bonding operations with varying bonding parameters is performed. Optimum bond parameters are derived from the signal of the sensor.</p> |
