发明名称 APPARATUS AND METHOD FOR MAPPING WAFER
摘要 PURPOSE: An apparatus and a method for mapping a wafer are provided to reduce a space for mapping unit and a working time by adding a wafer detection sensor and a mapping result decision portion. CONSTITUTION: An apparatus for mapping a wafer includes a wafer carrier robot(202), a wafer sensing portion(208), and a robot control portion(210). The wafer carrier robot has a robot arm(204). The wafer carrier robot is used for performing a wafer carrying process by using the robot arm. The wafer sensing portion is installed at the wafer carrier robot in order to sense the inserting state of a wafer of a wafer cassette. The robot control portion is loaded into the wafer carrier robot in order to sense the mapping state of the wafer within the wafer cassette according to the sensing result of the wafer sensing portion.
申请公布号 KR20030066036(A) 申请公布日期 2003.08.09
申请号 KR20020006188 申请日期 2002.02.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SON, TAE GYU
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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