发明名称 WORKPIECE TRANSFER SYSTEM, TRANSFER METHOD, VACUUM CHUCK, AND WAFER CENTERING METHOD
摘要 <p>A conveyance system E for wafers W includes a host computer 1 for carrying out the management of the production of semiconductor devices, a plurality of probers 2 for inspecting the electric characteristics of the wafers W under the administration of the host computer 1, an AGV 3 for automatically transporting the wafers W in block of a carrier in order to deliver the wafers W one by one to these probers 2 according to respective demands and an AGV controller 4 for controlling the operation of the AGV 3 under the administration of the host computer 1. <IMAGE></p>
申请公布号 KR20030066773(A) 申请公布日期 2003.08.09
申请号 KR20037008715 申请日期 2003.06.27
申请人 发明人
分类号 H01L21/66;G05B19/00;G05B19/418;H01L21/00;H01L21/68 主分类号 H01L21/66
代理机构 代理人
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