发明名称 MANUFACTURING METHOD OF HOLE FORMED CARD OR NAME PLATE
摘要 PURPOSE: A manufacturing method of hole formed card or name plate is provided in which hole is formed on the card or name plate to prevent loss of the card or name plate by using the card or name plate with cord or ring being inserted into the hole formed on the card or name plate. CONSTITUTION: The manufacturing method of hole formed card or name plate comprises the process of installing a hole(11) on front and rear sides of the body of card(10) or name plate including cash card, service card, residence certificate card and driver's license card so that a user is capable of using the card or name plate with cord(100) or ring being inserted into the hole(11) formed on the front and rear sides of the body of the card(10) or name plate, wherein the hole(11) is formed on the front and rear sides of the body of card(10) or name plate in the inner body of which semiconductor circuit layer(1) is interposed between mixed film layers(2) comprising bio ceramic calcite powder and PVC (polyvinyl chloride) so that the cord(100) or ring can be inserted into the hole when using the card(10) or name plate.
申请公布号 KR20030066160(A) 申请公布日期 2003.08.09
申请号 KR20020006346 申请日期 2002.02.04
申请人 LEE, SUNG MOON 发明人 LEE, SUNG MOON
分类号 B42D25/22;B42D25/23;B42D25/29;B42D25/40;(IPC1-7):B42D15/10 主分类号 B42D25/22
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