发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 A semiconductor device includes a first wiring line (11, 27, 27a) having a first through hole (13, 29), and a first connection member (12, 26, 34, 34a) which extends through the first through hole (13, 29) at an interval from the first wiring line (11, 27, 27a).
申请公布号 KR20030066446(A) 申请公布日期 2003.08.09
申请号 KR20030006732 申请日期 2003.02.04
申请人 发明人
分类号 H01L21/768;G11C11/16;H01L21/8242;H01L21/8246;H01L23/522;H01L27/00;H01L27/06;H01L27/105;H01L27/22;H01L43/08 主分类号 H01L21/768
代理机构 代理人
主权项
地址