发明名称 METHOD, APPARATUS, AND PROGRAM FOR MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To improve the productivity of a circuit board by performing mounting wherein the characteristics of components are combined with each other, and by preventing the need for manual work even when the faulty of a component is sensed. <P>SOLUTION: An electronic component mounting apparatus 100 so sucks supportingly electronic components by a plurality of suction heads 51 as to mount them on a circuit. By using the apparatus 100, heterogeneous characteristic electronic components including a plurality of kinds of individual characteristics are so combined with each other as to mount them on the circuit and obtain a desired circuit characteristic. In this case, faulty components are handled by a step for holding concurrently the combined heterogeneous characteristic electronic components by the plurality of suction heads 51, by a recognizing step for recognizing suction states of the held electronic components, and by a recovery step wherein, when the recognizing step has determined one of the heterogeneous characteristic electronic components as a faulty component, both the faulty component and the other heterogeneous characteristic electronic components associated with the faulty one are excluded selectively from the suction heads 51. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003224399(A) 申请公布日期 2003.08.08
申请号 JP20020021764 申请日期 2002.01.30
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KODERA KOJI;UCHIYAMA HIROSHI;SHIMIZU NOBUE;OGATA HIROSHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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