| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve yield by preventing damage to a wiring group and disconnection caused by pressure encountered in split and disconnection in splitting and disconnecting a glass substrate for a color filter for covering the mounting portion of an array substrate. <P>SOLUTION: In splitting and disconnecting the glass portion of the color filter substrate for covering the mounting portion on the array substrate by means of a scriber, a recessed part is formed below the wiring group on the array substrate located below the split and disconnected surface of the color filter to widen a gap between the split and disconnected portion and the wiring group. In addition, forming the projected part of a flattening film on the wiring group reduces pressure applied to the wiring group and prevents damage to the wiring group and the disconnection to improve the yield. <P>COPYRIGHT: (C)2003,JPO |
