| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a semiconductor aligner that when a wafer warped upward through various processes is corrected planarly using an electrostatic chuck, peripheral part of the wafer is attracted first and since only the central part is left while being swollen by the frictional force acting between the wafer and the chuck, plane correction of the wafer cannot be performed. SOLUTION: When a deformed wafer is adsorbed to an electrostatic chuck, the wafer is previously applied with a force in the radial direction and forcibly deformed mechanically up to an approximately planar state and then the wafer is mounted, as it is, on the electrostatic chuck and adsorbed electrostatically thus correcting the wafer up to a specified planarity. As an example of forced deforming means, the wafer is placed on a carrying hand, clamped mechanically at a plurality of points at the outer circumferential end thereof and then applied with a force in the radial direction. COPYRIGHT: (C)2003,JPO |
