| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To exfoliate a semiconductor chip 21 from an adhesive sheet 20 without breaking the adhesive sheet 20 in semiconductor chip pickup equipment. <P>SOLUTION: The adhesive sheet 20 on which the semiconductor chip 21 is stuck is fixed on a stage 1. Pushing up the adhesive sheet 20 is performed repeatedly by using a plurality of protruding members 2 while a roller 3 having the plurality of protruding members 2 is rotated. The whole adhesive sheet 20 at a sticking part position of the semiconductor chip 21 is pushed-up without adhesion of the protruding members 2 to the adhesive sheet 20, and the whole part of the semiconductor chip 21 is exfoliated. <P>COPYRIGHT: (C)2003,JPO</p> |
