发明名称 METHOD FOR MANUFACTURING pn JUNCTION DIODE AND pn JUNCTION DIODE
摘要 PROBLEM TO BE SOLVED: To provide a pn junction diode in which the variation of a forward voltage drop (VF) is reduced. SOLUTION: The method for manufacturing a pn junction diode in which a defect region is formed in a cathode layer comprises a step of preparing a semiconductor wafer having an n-type cathode layer, a step of forming a p-type anode layer on the cathode layer so that an interface between the cathode layer and the anode layer is a pn junction surface, and a defect region forming step of forming a defect region in the anode layer near the pn junction region by ion-implanting in the anode layer. In this method, the defect region forming step includes steps of simultaneously ion-implanting ions having different mean projection ranges Rp, alternatively forming first and second ion implanted regions adjacently, partly superposing the concentration distribution of the crystal defect formed in the first and second ion-implanted regions, and forming the defect regions of substantially constant film thicknesses. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003224134(A) 申请公布日期 2003.08.08
申请号 JP20020023676 申请日期 2002.01.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISHIZAWA SHINICHI;TOMOMATSU YOSHIFUMI
分类号 H01L21/329;H01L29/32;H01L29/861;(IPC1-7):H01L21/329 主分类号 H01L21/329
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