| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an optical structure of a photoresist material having >100μm depth and to provide a method for forming an optical structure in photoresist with substantially larger thickness than a coating film formed by spin coating. SOLUTION: The method aims to form deep microstructures in photoresist. The method utilizes a pool of photoresist on top of a transparent substrate and the laser is located below the substrate. The structures are created in the photoresist by transmitting the laser light through the substrate up into the photoresist. Since the photoresist does not have to be spin coated onto the substrate, very thick photoresist layers can be used while the thickness uniformity is determined by the substrate surface. Alternately, a contoured substrate can be used while producing a uniform structure. COPYRIGHT: (C)2003,JPO
|
