| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin semiconductor device in which heat dissipation properties are enhanced using a heat spreader of simple structure. SOLUTION: The semiconductor device 10 comprises a heat spreader 12 having one flat surface on which conductor patterns 16, 16,... having connection pads 18, 18,... for a semiconductor element connected electrically with the electrode terminals 15, 15,... of a semiconductor element 14 mounted are formed as a conductor pattern forming layer A, and a frame-like circuit board B having the pads 18, 18,... for external connection terminals formed on one side and bonded to the conductor pattern forming layer A on the other side. The conductor patterns 16, 16,... on the conductor pattern forming layer A are connected electrically with conductor patterns 34, 34,... formed on the circuit board B. The electrode terminals 15, 15,... of the semiconductor element 14 contained in a cavity 26 are connected electrically, by a flip-chip system, with the connection pads 18, 18,... for the semiconductor element exposed to the bottom face of the cavity 26 formed by the conductor pattern forming layer A and the circuit board B. COPYRIGHT: (C)2003,JPO
|
