RESIN MOLDED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin molded circuit board in which soldering can be carried out by means of an automatic soldering device for printed wiring board without using a jig. SOLUTION: In the resin molded circuit board 1 comprising a conductive plate 2 for forming an electric circuit sealed with molding resin 3, thin parts 32 are formed at two opposite sides of the molding resin 3. Reinforcing ribs 33 and 34 are formed in the molding resin 3 depending on the resin material being used. COPYRIGHT: (C)2003,JPO