| 摘要 |
PROBLEM TO BE SOLVED: To prevent a substrate carrying device from stopping operating and a substrate from being damaged when the carrying destination of the substrate to be carried inhibits the substrate from being carried in. SOLUTION: A resist coating/developing processing system has a cassette station, a processing station, and an interface station. A 2nd wafer carrying body which carries a wafer from a high-precision temperature control unit (CPL-G<SB>9</SB>) provided to the interface station to an in-stage of an exposure device mounts a held wafer temporarily on a rewinding unit (RSM) if the wafer can not be carried in the in-stage after being carried out of the high-precision temperature control unit (CPL-G<SB>9</SB>) since the wafer is ready to be carried in the in-stage. COPYRIGHT: (C)2003,JPO |
