| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a unit adhesive sheet assembly enabling an IC medium to be produced easily at a low cost by forming desired electrically conductive circuit(s) through cutting out or peeling an appropriate plurality of the unit adhesive sheets, appropriately combining them together and sticking them on the surface of an object such as an article like a base material (e.g. paper, plastic), card, label, tag or foam. <P>SOLUTION: This unit adhesive sheet assembly is such one that the respective unit adhesive sheets are provided with a plurality of electrically conductive circuit units differing in shape, size and function from one another. An appropriate plurality of the unit adhesive sheets are selected and removed from the assembly, appropriately combined together, and stuck on the surface of an object. <P>COPYRIGHT: (C)2003,JPO |
