| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a conventional electronic component housing case for housing an electronic component is entirely formed by resin-molding, its thickness is limited to 0.4 mm due to the molding, the thickness of the case is increased, and the thickness of a portable electronic apparatus for housing the case is increased. SOLUTION: A top surface plate 11 of the electronic component housing case is formed of a thin metal plate, and the thickness of the plate 1 can be reduced by outsert-molding. Accordingly, the thickness of the case can be thinned, and hence the thickness of the portable electronic apparatus for housing the case can be also thinned. COPYRIGHT: (C)2003,JPO
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