| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder plating method of a printed wiring board having two types of connecting parts, i.e., a solder packaging connection terminal part and a contact connection terminal part, wherein a shielding plate is not required above the contact connection terminal part in the reflow process of solder packaging and a smooth surface state can be sustained even after reflow. SOLUTION: In the solder plating method of a printed wiring board, a solder plating film is formed by plating the printed wiring board using a bright solder plating liquid containing tin metal ions, lead metal ions, an organic acid and a brightener while setting a current density at 0.1-5 (A/dm<SP>2</SP>), the rate of stirring caused by the vertical or lateral reciprocation of the printed wiring board in the solder plating liquid at 1-6 (m/min), and the ratio of stirring rate/current density at 2.0 or above. COPYRIGHT: (C)2003,JPO
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