| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed board having a ratio of wiring width/wiring gap=40/50μm with high yield while eliminating a shear drop or the like of the shape of the shoulder (4) of a through hole incident to polishing. SOLUTION: In the method for manufacturing a printed board, a metal layer on the surface of a substrate is polished by 5μm or more by means of a tubular or planar polishing material having a hardness of about 1,000 HV or above in a surface smoothing process preceding to circuit formation. COPYRIGHT: (C)2003,JPO
|
