| 摘要 |
PROBLEM TO BE SOLVED: To provide a small high frequency package in which direct coupling is prevented between specified amplifiers in a package while preventing the mounting density from lowering. SOLUTION: In a high frequency package comprising a packaged sealed hermetically with one package cover and having an electromagnetic shielding function for containing a high frequency circuit, a cavity section for containing the high frequency circuit provided in the package body has a plurality of parts shielded partially by a barrier wall having an electromagnetic shielding function. An electric connecting means for earthing the package cover at the barrier wall is provided between the barrier wall and the package cover. The width at each part of the cavity section shielded by the barrier wall is set narrower than the cut-off width of the high frequency circuit for a high frequency signal. COPYRIGHT: (C)2003,JPO
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