发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent a leak current from being generated and is highly reliable. SOLUTION: The semiconductor device 100 has a silicon substrate 101 which has a main surface 101f and includes a trench 107 formed in the main surface 101f. The trench 107 is prescribed by surfaces including a bottom surface 107b, a flank 107s which connects with the bottom surface 107b and has a 1st inclination to the main surface 101f, and an intermediate surface 101c which is formed between the main surface 101f and bottom surface 107b and has a 2nd inclination less than the 1st inclination to the main surface 101f. Further, the semiconductor device 100 has an n-type impurity region 121. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003224183(A) 申请公布日期 2003.08.08
申请号 JP20020022772 申请日期 2002.01.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHIMIZU HIDE
分类号 H01L21/8247;H01L21/60;H01L21/76;H01L21/762;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/76;H01L21/824 主分类号 H01L21/8247
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