| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic part in which a nondefective solder joint part where peeling-off at an interface of the joint part is suppressed is formed by using solder mainly composed of Sn and Zn, and a solder ball suitable therefor. SOLUTION: In the method for manufacturing the electronic part, after a terminal part is soldered with the solder mainly composed of Sn and Zn, heat treatment is performed at a temperature of 80°C or above and not over a melting temperature of the solder, to deposit a Zn layer on an interface between the solder joint part and the terminal part of the electronic part. The solder ball is mainly composed of Sn and Zn, and has a discontinuous Zn phase on its surface. COPYRIGHT: (C)2003,JPO
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