| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate treatment equipment and a substrate treatment method wherein influence of particles upon a substrate is restrained and saving space and cost reduction can be realized. SOLUTION: The substrate treatment equipment wherein treatment fluid is supplied to a substrate W and treatment is performed is provided with a holding member 60 for holding the substrate W, a chuck member 61 for retaining the holding means 60, and an upper surface member 62 which approaches the substrate W and covers a surface. The equipment has a constitution wherein the holding member 60 and the upper surface member 62 are collectively rotated by retaining the upper surface member 62 with the chuck member 61. COPYRIGHT: (C)2003,JPO
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