| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive composition which exhibits high bond strength to a substrate constituted of a metal and an inorganic material, has excellent storage stability at a room temperature (20-30°C) and sufficient performances even after a reliability test, an adhesive composition for connecting a circuit and to provide a method for connecting a circuit. SOLUTION: This adhesive composition comprises (a) a radically polymerizable compound, (b) a radical generator and (c) a chain transfer agent. The chain transfer agent (c) is preferably a mercapto compound of alcohol. In this method for connecting a circuit in which an adhesive composition is laid between substrates having mutually opposing circuit electrodes, the substrates having the mutually opposing circuit electrodes are pressurized and the electrodes in the pressure direction are electrically connected, the adhesive composition for connecting a circuit is obtained by using this adhesive composition. COPYRIGHT: (C)2003,JPO
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