Arrangement for mounting of a semiconductor casing on a plate support using a base, used for optical semiconductors having optical sensors and lenses

摘要

The device has a base interposed between a rear face of the case and a front face of the plate support, and in which the electric connection unit of this case and this plate support traverses this base. There are mounting units (22,24), mounting the case on this plate support, which cooperates with, and are placed on top of the rear face of this case.