| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wafer heating device in which the temperature can be stabilized rapidly against changes of the temperature and which has a superior durability, by fixing the temperature measuring element by means of a filler. SOLUTION: In the wafer heating device in which an exothermic resistor is formed on the face or inside a ceramics plate, a bottomed hole is installed at the ceramics plate, and the temperature measuring element is provided with the bottomed hole, the temperature measuring element is fixed with the filler having the thermal conductivity of 8.3 to 150% against the thermal conductivity of the ceramics plate. COPYRIGHT: (C)2003,JPO
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