| 摘要 |
PROBLEM TO BE SOLVED: To attain an electroless plating adhesive technology by which a printed wiring board having excellent peeling strength can be provided stably even in wiring of higher density and high pattern accuracy. SOLUTION: In the printed wiring board, a homogeneous mixture of a photosensitive resin and a thermoplastic resin is used as a heatresistant resin matrix of an electroless plating adhesive; then, the mixture is cured to form a homogeneous resin compound having psedohomogeneous compatibility structure, co- continuity structure, or spherical domain structure; the resin compound is used as an electroless plating adhesive layer; and the electroless plating adhesive layer is formed on the printed wiring board. As a result, the resin matrix of the electroless plating adhesive layer can be strengthened without a decrease in heatresistance, electrical insulation, and chemical stability, then, the printed wiring board having superior peeling strength is provided stably even in the wiring of higher density and high pattern accuracy. COPYRIGHT: (C)2003,JPO
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