| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem about the fact that foreign particles such as resin burrs are introduced between a mounting board and the mounting surface of a conventional semiconductor device to cause a failure when the semiconductor device is mounted on the mounting board. <P>SOLUTION: This semiconductor device 21 is provided with a recess 25 on the rear 224 of a resin sealed body 22 which serves as its mounting surface. An exposed region where leads 26 are exposed and the rear 224 of the resin sealed body 22 are nearly flush with each other to form a plane outside the recess 25. Therefore, even if foreign particles such as the crushed particles of burrs of the leads 26 and resin burrs are produced in this QFN semiconductor device 21, the foreign particles are positioned in the recess 25 formation region, so that the mounting failures can be avoided. <P>COPYRIGHT: (C)2003,JPO |
