发明名称 LEAD PIN WITH Au-Ge SYSTEM BRAZING MATERIAL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a lead pin with a brazing material from which the brazing material does not exfoliate even if a shock is applied, through the use of an Au-Ge system brazing material. <P>SOLUTION: This lead pin with the Au-Ge system brazing material is constituted by plating nickel and gold at least on a junction face with a substrate of the lead pin that consists of a metal containing copper and by making the Au-Ge system brazing material welded on the gold-plated face. After the nickel- plated lead pin is given a heat treatment, it is gold-plated and then welded with the brazing material. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003223945(A) 申请公布日期 2003.08.08
申请号 JP20020022171 申请日期 2002.01.30
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 KOBAYASHI MASARU
分类号 B23K35/00;B23K35/30;C22C5/02;H01L23/498;H01R4/02;H05K3/34;(IPC1-7):H01R12/04 主分类号 B23K35/00
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