| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a long-life wafer support member by reducing cracking of a ceramic base body by reducing a meniscus of a solder material formed between an insert part tip surface of a feed terminal and an internal wall surface of a fixed hole when the feed terminal is soldered in the fixed hole bored in the ceramic base body 2. <P>SOLUTION: In the fixed hole 10 formed penetrating a heater electrode 4 in the ceramic base body 2 having the heater electrode 4 buried, a metallized layer 13 is formed and the feed terminal 8 is inserted and soldered. At this time, ceramic particles are stuck on the insert part tip surface of the feed electrode 8 and the meniscus of the solder material formed between the insert tip surface of the feed electrode 8 and the metallized layer 13 in the fixed hole 10 is reduced. <P>COPYRIGHT: (C)2003,JPO</p> |
