| 摘要 |
PROBLEM TO BE SOLVED: To remove particles on the surface of a wafer by sustaining a constant discharging rate of solution. SOLUTION: The wafer drying equipment comprises an inner tank 10, an outer tank 20, a solution supply line 50, solution discharge lines 60 and 70, a pump 280 and a drying means. The solution discharge line comprises a first discharge line 60 and a second discharge line 70 wherein a pump for sustaining a constant discharging rate of solution is provided in the first discharge line. The drying means comprises an IPA nozzle 90 for ejecting isopropylalcohol, first gas jet nozzles 330 for jetting nitrogen gas, and second gas jet nozzles 320. The second gas jet nozzles are mounted on the four inner side walls of the outer tank and provided with a large number of holes and can prevent the generation of waves on the surface of solution being discharged. COPYRIGHT: (C)2003,JPO
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